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AC PCB M185 Multilayer FR4 High TG Flex-Rigid HDI PCB Design Service Heavy Copper Printed Circuit Board OSP Surface Finish
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Material FR-4 Functional Application / Type Pcb Board Base Material FR-1,CEM-1 CEM-3,FR-4 Board Thickness 1.6mm(0.06in) Copper Thickness 36u Min. Hole Size 0.2mm(0.01in) Min. Line Width 0.075mm part Min. Line Spacing 0.075mm part Surface Finishing OSP Board Size / Product model AC-PCB-M185 Basic Laminate type FR-1,CEM-1 CEM-3,FR-4 Layers 2-10 layers Finishing type 0.2-3.0MM Inner core board […]
Introduction
| Material | FR-4 | Functional Application | / |
| Type | Pcb Board | Base Material | FR-1,CEM-1 CEM-3,FR-4 |
| Board Thickness | 1.6mm(0.06in) | Copper Thickness | 36u |
| Min. Hole Size | 0.2mm(0.01in) | Min. Line Width | 0.075mm part |
| Min. Line Spacing | 0.075mm part | Surface Finishing | OSP |
| Board Size | / | Product model | AC-PCB-M185 |
| Basic Laminate type | FR-1,CEM-1 CEM-3,FR-4 | Layers | 2-10 layers |
| Finishing type | 0.2-3.0MM | Inner core board (minimum) | 0.15MM (including copper) |
| Thickness tolerance | ±0.075MM | Plate type | FR-4, high TG,CEM-3 |
| Copper thickness of outer layer | 4140Z | Inner copper thickness | 3/30Z |
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