Custom OEM for 5G Communication High Frequency PCBs and High Speed PCB Assembly

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Custom OEM for 5G Communication High Frequency PCBs and High Speed PCB Assembly


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Type High Frequency PCB Base Material RO4350B+TU768 Board Thickness 1.6±0.1mm Copper Thickness 1 OZ for both inner and outer layers Min. Hole Size Laser hole 0.1mm, mechanical hole 0.2mm Min. Line Width 0.35mm(0.01in) Surface Finishing ENIG (Electroless Nickel Immersion Gold)


TypeHigh Frequency PCBBase MaterialRO4350B+TU768
Board Thickness1.6±0.1mmCopper Thickness1 OZ for both inner and outer layers
Min. Hole SizeLaser hole 0.1mm, mechanical hole 0.2mmMin. Line Width0.35mm(0.01in)
Surface FinishingENIG (Electroless Nickel Immersion Gold)


Our website currently displays only a selection of our circuit board products. If you have specific requirements or need more detailed information, feel free to contact us. Our experienced team is ready to provide customized solutions tailored to your project needs. Whether it's design optimization, functional integration, or material selection, we are here to support your goals. Let's work together to develop high-quality circuit board solutions that empower your brand.

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