Custom 10 Layer High Frequency PCB Fast Turn Rogers PCBA for 5G Telecom RF Systems with Impedance Control

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Custom 10 Layer High Frequency PCB Fast Turn Rogers PCBA for 5G Telecom RF Systems with Impedance Control


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Material Rogers / Taconic / Arlon / ShengYi Functional Application 5G 6G Base Station / RF Microwave Type RF High Frequency PCBA / Turnkey Assembly Base Material Rogers (RO4350B / RO4003C) Hybrid with High TG FR4 Board Thickness 1.0mm / 1.2mm / 1.6mm / 2.0mm Copper Thickness 0.5oz / 1oz / 2oz Min. Hole Size […]


MaterialRogers / Taconic / Arlon / ShengYiFunctional Application5G 6G Base Station / RF Microwave
TypeRF High Frequency PCBA / Turnkey AssemblyBase MaterialRogers (RO4350B / RO4003C) Hybrid with High TG FR4
Board Thickness1.0mm / 1.2mm / 1.6mm / 2.0mmCopper Thickness0.5oz / 1oz / 2oz
Min. Hole Size0.1mm (Laser Microvia) / 0.15mm (Mechanical)Min. Line Width0.05mm (2mil)
Min. Line Spacing0.05mm (2mil)Surface FinishingImmersion Silver (Ag) / ENIG / ENEPIG / Hard Gold
Board Size10 Layers (Precision Hybrid Stack-up)Layer Count10 layers
Surface Roughness ControlHVLP copper Ra ≤ 0.5um (for minimal signal loss)Dk / DfDk 3.0-10.2 / Df 0.001-0.020 @10GHz (material dependent)
Impedance Tolerance±5% (TDR tested, 50Ω/100Ω)Back Drilling Depth Control±0.05 mm precision
HDI TechnologyLaser drilled blind/buried vias, 0.1 mm holeVia-in-PadResin plugging & copper plated over
ENIG ThicknessAu 2-4u" / Ni 120-200u"Copper Foil TypeHVLP / RTF / VLP (for low loss)
CertificationsUL, RoHS, REACH, ISO9001, IATF16949


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