High-Reliability Multilayer Switch PCB Manufacturer Fast Turn Custom Assembly for Cloud Telecom High TG 170C 2.0mm Thick

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High-Reliability Multilayer Switch PCB Manufacturer Fast Turn Custom Assembly for Cloud Telecom High TG 170C 2.0mm Thick


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Number of Layers 16-layer Solder Mask Green Type Multilayer pcb Board Thickness 2.0mm(0.08in) Board Size custom pcb Base Material 170GRA2 Copper Thickness 1-6 OZ Min. Hole Size 0.25mm(0.01in) Min. Line Width 100μm Min. Line Spacing 100μm Surface Finishing OSP (Organic Solderability Preservative) Base Material TG High TG 170°C (TG170) Aspect Ratio 12:1 Min Drilling Hole […]


Number of Layers16-layerSolder MaskGreen
TypeMultilayer pcbBoard Thickness2.0mm(0.08in)
Board Sizecustom pcbBase Material170GRA2
Copper Thickness1-6 OZMin. Hole Size0.25mm(0.01in)
Min. Line Width100μmMin. Line Spacing100μm
Surface FinishingOSP (Organic Solderability Preservative)Base Material TGHigh TG 170°C (TG170)
Aspect Ratio12:1Min Drilling Hole Size0.3mm (12 mil) Mechanical Drill
Hole Wall Copper Thickness25um (1 mil) AverageOperating Temperature-40°Cto +150°C
Withstanding Voltage≥1000V AC (Layer to Layer)Thermal Conductivity≥2.0 W/m-K (with Metal Core)
Impedance Control Tolerance±10% Controlled ImpedanceFlammability RatingUL 94V-0
Application ScenariosEV Motor Controllers Industrial Drives High-Power Inverters


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