HDI FPC Board High Density Interconnect Flex PCB Fine Pitch 0.3mm 0.4mm BGA Microvia Custom Factory

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HDI FPC Board High Density Interconnect Flex PCB Fine Pitch 0.3mm 0.4mm BGA Microvia Custom Factory


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Type FPC Base Material Polyimide Board Thickness 0.3-0.4mm(0.01-0.02in) Min. Line Spacing 2/2mil (Laser Via/Microvia) Surface Finishing ENIG Number of Layers 4-8 Layer


TypeFPCBase MaterialPolyimide
Board Thickness0.3-0.4mm(0.01-0.02in)Min. Line Spacing2/2mil (Laser Via/Microvia)
Surface FinishingENIGNumber of Layers4-8 Layer


Our website currently displays only a selection of our circuit board products. If you have specific requirements or need more detailed information, feel free to contact us. Our experienced team is ready to provide customized solutions tailored to your project needs. Whether it's design optimization, functional integration, or material selection, we are here to support your goals. Let's work together to develop high-quality circuit board solutions that empower your brand.

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