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1.5mm High-Frequency High-Density Interconnect PCB Board with 3oz Copper and Immersion Silver Finish
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Type PCB Copper Thickness 3oz Structure 7+N+7 HDI Stack Via Any Layer(16L) Min Trace/Spacing Inner 40/40 um; Outer 40/50 um MAX PCB Aspect Ratio 1:1 Min Laser Drilling 3 mil Min. Core Thickness 0.17mm Min BGA Pitch 0.3mm
Introduction
| Type | PCB | Copper Thickness | 3oz |
| Structure | 7+N+7 | HDI Stack Via | Any Layer(16L) |
| Min Trace/Spacing | Inner 40/40 um; Outer 40/50 um | MAX PCB Aspect Ratio | 1:1 |
| Min Laser Drilling | 3 mil | Min. Core Thickness | 0.17mm |
| Min BGA Pitch | 0.3mm |
Our website currently displays only a selection of our circuit board products. If you have specific requirements or need more detailed information, feel free to contact us. Our experienced team is ready to provide customized solutions tailored to your project needs. Whether it's design optimization, functional integration, or material selection, we are here to support your goals. Let's work together to develop high-quality circuit board solutions that empower your brand.
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