1.5mm High-Frequency High-Density Interconnect PCB Board with 3oz Copper and Immersion Silver Finish

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1.5mm High-Frequency High-Density Interconnect PCB Board with 3oz Copper and Immersion Silver Finish


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Type PCB Copper Thickness 3oz Structure 7+N+7 HDI Stack Via Any Layer(16L) Min Trace/Spacing Inner 40/40 um; Outer 40/50 um MAX PCB Aspect Ratio 1:1 Min Laser Drilling 3 mil Min. Core Thickness 0.17mm Min BGA Pitch 0.3mm


TypePCBCopper Thickness3oz
Structure7+N+7HDI Stack ViaAny Layer(16L)
Min Trace/SpacingInner 40/40 um; Outer 40/50 umMAX PCB Aspect Ratio1:1
Min Laser Drilling3 milMin. Core Thickness0.17mm
Min BGA Pitch0.3mm


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