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Electronic Flex PCB Industrial Flex PCB Module
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Type FPC Base Material Polyimide PI FR4 Board Thickness 0.05mm-0.75mm(0in-0.03in) Board Size 200* 300MM(7.87*11.81in) Copper Thickness 0.5-4.0 Oz Min. Hole Size 0.1mm(0in) Min. Line Width ±0.02mm Min. Line Spacing ±0.05mm Surface Finishing Immersion Gold/OSP Min. Hole Size 0.1mm Base Material Polyimide PI Board Thickness 0.05mm-0.75mm Min. Line Width 0.05mm Surface Finishing Immersion Gold
Introduction
| Type | FPC | Base Material | Polyimide PI FR4 |
| Board Thickness | 0.05mm-0.75mm(0in-0.03in) | Board Size | 200* 300MM(7.87*11.81in) |
| Copper Thickness | 0.5-4.0 Oz | Min. Hole Size | 0.1mm(0in) |
| Min. Line Width | ±0.02mm | Min. Line Spacing | ±0.05mm |
| Surface Finishing | Immersion Gold/OSP | Min. Hole Size | 0.1mm |
| Base Material | Polyimide PI | Board Thickness | 0.05mm-0.75mm |
| Min. Line Width | 0.05mm | Surface Finishing | Immersion Gold |
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