High Thermal Conductivity Ceramic PCB with Aluminum Nitride Substrate for High Power LED and Automotive Electronics

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High Thermal Conductivity Ceramic PCB with Aluminum Nitride Substrate for High Power LED and Automotive Electronics


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Type ceramic pcb Base Material ALN Board Thickness 1.0mm(0.04in) Copper Thickness 2OZ Min. Hole Size 0.2MM(0.01in) Min. Line Width 0.15MM(0.01in) Min. Line Spacing 0.15MM(0.01in) Surface Finishing ENIG Board Size 18*18mm(0.71*0.71in) Keywords ceramic pcb Solder Mask color White Certificate ISO9001/ISO14001/CE/ROHS Layer single side


Typeceramic pcbBase MaterialALN
Board Thickness1.0mm(0.04in)Copper Thickness2OZ
Min. Hole Size0.2MM(0.01in)Min. Line Width0.15MM(0.01in)
Min. Line Spacing0.15MM(0.01in)Surface FinishingENIG
Board Size18*18mm(0.71*0.71in)Keywordsceramic pcb
Solder Mask colorWhiteCertificateISO9001/ISO14001/CE/ROHS
Layersingle side


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