High Density BGA QFN Automatic Soldering for PCBA Production for Consumer Electronics SMT TH Manufacturing

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High Density BGA QFN Automatic Soldering for PCBA Production for Consumer Electronics SMT TH Manufacturing


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Base Material FR4 94v0 Circuit Board Board Thickness 1.6MM(0.06in) Copper Thickness 1 – 4OZ Min. Hole Size 0.2mm(0.01in) Min. Line Width 4MIL Min. Line Spacing 0.2MM(0.01in) Surface Finishing OSP,Immersion Gold,Immersion Tin,Immersion Ag Product name Printed Circuit Board Application Electronics Device Keywords Multilayer Electronic Circuit Board Layer 1-40layers Service OEM Services Provided Solder mask color GreenWhiteRedBlueBlack […]


Base MaterialFR4 94v0 Circuit BoardBoard Thickness1.6MM(0.06in)
Copper Thickness1 - 4OZMin. Hole Size0.2mm(0.01in)
Min. Line Width4MILMin. Line Spacing0.2MM(0.01in)
Surface FinishingOSP,Immersion Gold,Immersion Tin,Immersion AgProduct namePrinted Circuit Board
ApplicationElectronics DeviceKeywordsMultilayer Electronic Circuit Board
Layer1-40layersServiceOEM Services Provided
Solder mask colorGreenWhiteRedBlueBlackUsageOEM Electronics
ItemCustom Circuit BoardTesting ServiceFlying Probe Testing
Application fieldEnergy Storage UPS


Our website currently displays only a selection of our circuit board products. If you have specific requirements or need more detailed information, feel free to contact us. Our experienced team is ready to provide customized solutions tailored to your project needs. Whether it's design optimization, functional integration, or material selection, we are here to support your goals. Let's work together to develop high-quality circuit board solutions that empower your brand.

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