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Custom Blind and Buried Via PCB HDI Multilayer Board Laser Microvia Stacked Via High Density Interconnect PCB Manufacturer
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Type Blind and Buried Via PCB Base Material FR-4 High Tg / Rogers / Megtron / Isola Board Thickness 0.8-6.-0mm Copper Thickness 0.5 – 6oz Min. Line Width 3mil (down to 2mil) Min. Line Spacing 3mil (down to 2mil) Surface Finishing ENIG / Immersion Silver / OSP / Hard Gold Layers 4-28 Certificate ISO9001, UL, […]
Introduction
| Type | Blind and Buried Via PCB | Base Material | FR-4 High Tg / Rogers / Megtron / Isola |
| Board Thickness | 0.8-6.-0mm | Copper Thickness | 0.5 - 6oz |
| Min. Line Width | 3mil (down to 2mil) | Min. Line Spacing | 3mil (down to 2mil) |
| Surface Finishing | ENIG / Immersion Silver / OSP / Hard Gold | Layers | 4-28 |
| Certificate | ISO9001, UL, RoHS, IATF16949 | Via Type | Blind Via / Buried Via / Through Hole / Stacked / Staggered / Microvia |
| MOQ | 1pcs | Min Microvia | 0.075mm |
Our website currently displays only a selection of our circuit board products. If you have specific requirements or need more detailed information, feel free to contact us. Our experienced team is ready to provide customized solutions tailored to your project needs. Whether it's design optimization, functional integration, or material selection, we are here to support your goals. Let's work together to develop high-quality circuit board solutions that empower your brand.
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China Loong Circuit Board Co., Ltd. specializes in the development and manufacturing of high-quality printed circuit boards (PCBs), serving a wide range of applications including industrial control, home appliances, new energy, medical devices, consumer electronics, IoT, and security systems. We offer OEM/ODM services to meet customized design and functionality needs. With a skilled R&D team and advanced production facilities, we are committed to delivering reliable, efficient, and innovative PCB solutions to clients worldwide.
