Customized Hybrid Lamination PCB With Gerber RO4350B High TG FR4 RF Power Amplifier High Frequency Printed Circuit Board

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Customized Hybrid Lamination PCB With Gerber RO4350B High TG FR4 RF Power Amplifier High Frequency Printed Circuit Board


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Type Hybrid Lamination PCB Base Material FR4, Rogers, Taconic, PTFE, PPO, Metal Core Board Thickness 0.2mm-5.0mm(0.01in-0.20in) Copper Thickness 0.5oz-20oz Min. Hole Size 0.075mm /3mil Min. Line Width 0.075mm /3mil Min. Line Spacing 0.075mm /3mil Surface Finishing ENIG, HASL, OSP, Immersion Tin, ENEPIG Board Size Max.600×510 mm PCB Type Hybrid Lamination Printed Circuit Board Application RF […]


TypeHybrid Lamination PCBBase MaterialFR4, Rogers, Taconic, PTFE, PPO, Metal Core
Board Thickness0.2mm-5.0mm(0.01in-0.20in)Copper Thickness0.5oz-20oz
Min. Hole Size0.075mm /3milMin. Line Width0.075mm /3mil
Min. Line Spacing0.075mm /3milSurface FinishingENIG, HASL, OSP, Immersion Tin, ENEPIG
Board SizeMax.600x510 mmPCB TypeHybrid Lamination Printed Circuit Board
ApplicationRF Power Amplifier ElectronicsCertificateISO14001, ISO45001, IATF16949, UL, ISO13485
Solder Mask ColorGreen, White, Blue, Black, Red, PurpleLayer1-32 layers
Finish Hole Tolerance (PTH)±0.05 mmFinish Hole Tolerance (NPTH)±0.025 mm
One-Stop ServiceHybrid Lamination PCB Design Manufacturing and PCBA AssemblyPCBA serviceSMD SMT DIP Component Assembly
Production FilesGerber, BOM, Pick and Place


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