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Customized Hybrid Lamination PCB With Gerber RO4350B High TG FR4 RF Power Amplifier High Frequency Printed Circuit Board
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Type Hybrid Lamination PCB Base Material FR4, Rogers, Taconic, PTFE, PPO, Metal Core Board Thickness 0.2mm-5.0mm(0.01in-0.20in) Copper Thickness 0.5oz-20oz Min. Hole Size 0.075mm /3mil Min. Line Width 0.075mm /3mil Min. Line Spacing 0.075mm /3mil Surface Finishing ENIG, HASL, OSP, Immersion Tin, ENEPIG Board Size Max.600×510 mm PCB Type Hybrid Lamination Printed Circuit Board Application RF […]
Introduction
| Type | Hybrid Lamination PCB | Base Material | FR4, Rogers, Taconic, PTFE, PPO, Metal Core |
| Board Thickness | 0.2mm-5.0mm(0.01in-0.20in) | Copper Thickness | 0.5oz-20oz |
| Min. Hole Size | 0.075mm /3mil | Min. Line Width | 0.075mm /3mil |
| Min. Line Spacing | 0.075mm /3mil | Surface Finishing | ENIG, HASL, OSP, Immersion Tin, ENEPIG |
| Board Size | Max.600x510 mm | PCB Type | Hybrid Lamination Printed Circuit Board |
| Application | RF Power Amplifier Electronics | Certificate | ISO14001, ISO45001, IATF16949, UL, ISO13485 |
| Solder Mask Color | Green, White, Blue, Black, Red, Purple | Layer | 1-32 layers |
| Finish Hole Tolerance (PTH) | ±0.05 mm | Finish Hole Tolerance (NPTH) | ±0.025 mm |
| One-Stop Service | Hybrid Lamination PCB Design Manufacturing and PCBA Assembly | PCBA service | SMD SMT DIP Component Assembly |
| Production Files | Gerber, BOM, Pick and Place |
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