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High Quality 12 Layer HDI PCB High TG 170C Immersion Gold Surface Advanced Custom Solutions for Network Communication
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Number of Layers 12-layer Solder Mask Green Type Multilayer pcb Board Thickness 0.8mm(0.03in) Board Size custom pcb Base Material Taiyo EM390, 0.064mm (likely indicating the materi Copper Thickness 1-6 OZ Min. Hole Size Through-hole: 0.5mm; Blind via: 0.1mm Min. Line Width 40μm Min. Line Spacing 50μm Surface Finishing Immersion Gold (ENIG) + OSP (Organic Solderability […]
Introduction
| Number of Layers | 12-layer | Solder Mask | Green |
| Type | Multilayer pcb | Board Thickness | 0.8mm(0.03in) |
| Board Size | custom pcb | Base Material | Taiyo EM390, 0.064mm (likely indicating the materi |
| Copper Thickness | 1-6 OZ | Min. Hole Size | Through-hole: 0.5mm; Blind via: 0.1mm |
| Min. Line Width | 40μm | Min. Line Spacing | 50μm |
| Surface Finishing | Immersion Gold (ENIG) + OSP (Organic Solderability | Base Material TG | High TG 170°C (TG170) |
| Aspect Ratio | 12:1 | Min Drilling Hole Size | 0.3mm (12 mil) Mechanical Drill |
| Hole Wall Copper Thickness | 25um (1 mil) Average | Operating Temperature | -40°Cto +150°C |
| Withstanding Voltage | ≥1000V AC (Layer to Layer) | Thermal Conductivity | ≥2.0 W/m-K (with Metal Core) |
| Impedance Control Tolerance | ±10% Controlled Impedance | Flammability Rating | UL 94V-0 |
| Application Scenarios | EV Motor Controllers Industrial Drives High-Power Inverters |
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