High Quality 12 Layer HDI PCB High TG 170C Immersion Gold Surface Advanced Custom Solutions for Network Communication

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High Quality 12 Layer HDI PCB High TG 170C Immersion Gold Surface Advanced Custom Solutions for Network Communication


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Number of Layers 12-layer Solder Mask Green Type Multilayer pcb Board Thickness 0.8mm(0.03in) Board Size custom pcb Base Material Taiyo EM390, 0.064mm (likely indicating the materi Copper Thickness 1-6 OZ Min. Hole Size Through-hole: 0.5mm; Blind via: 0.1mm Min. Line Width 40μm Min. Line Spacing 50μm Surface Finishing Immersion Gold (ENIG) + OSP (Organic Solderability […]


Number of Layers12-layerSolder MaskGreen
TypeMultilayer pcbBoard Thickness0.8mm(0.03in)
Board Sizecustom pcbBase MaterialTaiyo EM390, 0.064mm (likely indicating the materi
Copper Thickness1-6 OZMin. Hole SizeThrough-hole: 0.5mm; Blind via: 0.1mm
Min. Line Width40μmMin. Line Spacing50μm
Surface FinishingImmersion Gold (ENIG) + OSP (Organic SolderabilityBase Material TGHigh TG 170°C (TG170)
Aspect Ratio12:1Min Drilling Hole Size0.3mm (12 mil) Mechanical Drill
Hole Wall Copper Thickness25um (1 mil) AverageOperating Temperature-40°Cto +150°C
Withstanding Voltage≥1000V AC (Layer to Layer)Thermal Conductivity≥2.0 W/m-K (with Metal Core)
Impedance Control Tolerance±10% Controlled ImpedanceFlammability RatingUL 94V-0
Application ScenariosEV Motor Controllers Industrial Drives High-Power Inverters


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