Custom Blind and Buried Via PCB HDI Multilayer Board Laser Microvia Stacked Via High Density Interconnect PCB Manufacturer
$6-22
/piece
Price varies depending on material, logo, quantity and customization requirements.
Quality You Can Trust
Flexible & Scalable Solutions
Customizable Product Options
Comprehensive Specifications
Your Reliable Business Partner
Category:
Multilayer Pcb
Introduction
| Type | Blind and Buried Via PCB | Base Material | FR-4 High Tg / Rogers / Megtron / Isola |
| Board Thickness | 0.8-6.-0mm | Copper Thickness | 0.5 - 6oz |
| Min. Line Width | 3mil (down to 2mil) | Min. Line Spacing | 3mil (down to 2mil) |
| Surface Finishing | ENIG / Immersion Silver / OSP / Hard Gold | Layers | 4-28 |
| Certificate | ISO9001, UL, RoHS, IATF16949 | Via Type | Blind Via / Buried Via / Through Hole / Stacked / Staggered / Microvia |
| MOQ | 1pcs | Min Microvia | 0.075mm |
We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.
Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:
- Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
- Strict quality control covering material selection, processing, surface finishing, and final packaging;
- Variety of products and specifications to meet diverse project requirements and application scenarios;
- OEM & customization support based on drawings, samples, or specific technical requirements;
- Flexible packaging solutions to ensure safe handling and transportation of products;
- Continuous improvement in products and services to better support customers in different markets.
If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.
