6 Layer HDI Drone PCB Prototype Second Order Precision Multilayer Board with High TG170 for Aerial Photography

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6 Layer HDI Drone PCB Prototype Second Order Precision Multilayer Board with High TG170 for Aerial Photography


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Material ShengYi (IT-180A) / Isola / Functional Application Aerial Photography Drone / FPV / Type High Density Interconnect (HDI) PCB Base Material High TG FR4 (TG170/180) Board Thickness 0.8mm / 1.0mm / 1.2mm Copper Thickness 1oz (35um) Min. Hole Size 0.075mm (3mil) Laser Microvia Min. Line Width 0.05mm (2mil) Min. Line Spacing 0.05mm (2mil) Surface […]


MaterialShengYi (IT-180A) / Isola /Functional ApplicationAerial Photography Drone / FPV /
TypeHigh Density Interconnect (HDI) PCBBase MaterialHigh TG FR4 (TG170/180)
Board Thickness0.8mm / 1.0mm / 1.2mmCopper Thickness1oz (35um)
Min. Hole Size0.075mm (3mil) Laser MicroviaMin. Line Width0.05mm (2mil)
Min. Line Spacing0.05mm (2mil)Surface FinishingENIG (Immersion Gold) / ENEPIG
Board Size6 Layers (Second-Order HDI)Base Material TGHigh TG 170°C (TG170)
Aspect Ratio12:1Min Drilling Hole Size0.3mm (12 mil) Mechanical Drill
Hole Wall Copper Thickness25um (1 mil) AverageOperating Temperature-40°Cto +150°C
Withstanding Voltage≥1000V AC (Layer to Layer)Thermal Conductivity≥2.0 W/m-K (with Metal Core)
Impedance Control Tolerance±10% Controlled ImpedanceFlammability RatingUL 94V-0
Application ScenariosEV Motor Controllers Industrial Drives High-Power Inverters


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