6 Layer Second Order FPV Drones PCB Precision HDI Prototype with FR4 High TG 170C ENIG Surface for Drones & Aerial Photography

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6 Layer Second Order FPV Drones PCB Precision HDI Prototype with FR4 High TG 170C ENIG Surface for Drones & Aerial Photography


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Number of Layers 6-layer Solder Mask Green Type Multilayer pcb Board Thickness 2.0mm(0.08in) Board Size custom pcb Base Material FR4 Copper Thickness 20Z Min. Hole Size 0.1mm(0in) Min. Line Width 0.1mm(0in) Min. Line Spacing 0.1mm(0in) Surface Finishing ENIG (Immersion Gold), Immersion Silver, HASL Base Material TG High TG 170°C (TG170) Aspect Ratio 12:1 Min Drilling […]


Number of Layers6-layerSolder MaskGreen
TypeMultilayer pcbBoard Thickness2.0mm(0.08in)
Board Sizecustom pcbBase MaterialFR4
Copper Thickness20ZMin. Hole Size0.1mm(0in)
Min. Line Width0.1mm(0in)Min. Line Spacing0.1mm(0in)
Surface FinishingENIG (Immersion Gold), Immersion Silver, HASLBase Material TGHigh TG 170°C (TG170)
Aspect Ratio12:1Min Drilling Hole Size0.3mm (12 mil) Mechanical Drill
Hole Wall Copper Thickness25um (1 mil) AverageOperating Temperature-40°Cto +150°C
Withstanding Voltage≥1000V AC (Layer to Layer)Thermal Conductivity≥2.0 W/m-K (with Metal Core)
Impedance Control Tolerance±10% Controlled ImpedanceFlammability RatingUL 94V-0
Application ScenariosEV Motor Controllers Industrial Drives High-Power Inverters


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