Buried PCB OSP Finish PCBA for Military Applications Featuring Military Grade 1oz Copper and Gold Plating

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Buried PCB OSP Finish PCBA for Military Applications Featuring Military Grade 1oz Copper and Gold Plating


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Type rigid pcb Base Material FR-4 (Glass Fiber Reinforced Epoxy) Board Thickness 0.8mm-3.2mm(0.03in-0.13in) Board Size HX Copper Thickness 0.2mm-0.3mm(0.01in-0.01in) Min. Hole Size 0.1mm-0.15mm(0in-0.01in) Min. Line Width 0.1mm-0.15mm(0in-0.01in) Min. Line Spacing Organic Solderability Preservative (OSP) Surface Finishing 100mm*100mm to 500mm*500mm Application Consumer electronics, industrial control


Typerigid pcbBase MaterialFR-4 (Glass Fiber Reinforced Epoxy)
Board Thickness0.8mm-3.2mm(0.03in-0.13in)Board SizeHX
Copper Thickness0.2mm-0.3mm(0.01in-0.01in)Min. Hole Size0.1mm-0.15mm(0in-0.01in)
Min. Line Width0.1mm-0.15mm(0in-0.01in)Min. Line SpacingOrganic Solderability Preservative (OSP)
Surface Finishing100mm*100mm to 500mm*500mmApplicationConsumer electronics, industrial control


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