Custom 10-Layer High-Frequency PCB Circuit Board Fast Turn 5G Telecom RF Systems ENIG Surface 1.8mm

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Custom 10-Layer High-Frequency PCB Circuit Board Fast Turn 5G Telecom RF Systems ENIG Surface 1.8mm


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Number of Layers 10-Layer Solder Mask Green Type Multilayer pcb Board Thickness 1.8mm(0.07in) Board Size custom Base Material Rogers / Taconic / Arlon / PTFE / FR4 High TG Copper Thickness 1OZ Min. Hole Size 0.3mm(0.01in) Min. Line Width 0.35mm(0.01in) Min. Line Spacing 0.2mm(0.01in) Surface Finishing ENIG (Immersion Gold), Immersion Silver, HASL Layer Count 10 […]


Number of Layers10-LayerSolder MaskGreen
TypeMultilayer pcbBoard Thickness1.8mm(0.07in)
Board SizecustomBase MaterialRogers / Taconic / Arlon / PTFE / FR4 High TG
Copper Thickness1OZMin. Hole Size0.3mm(0.01in)
Min. Line Width0.35mm(0.01in)Min. Line Spacing0.2mm(0.01in)
Surface FinishingENIG (Immersion Gold), Immersion Silver, HASLLayer Count10 layers
Surface Roughness ControlHVLP copper Ra ≤ 0.5um (for minimal signal loss)Dk / DfDk 3.0-10.2 / Df 0.001-0.020 @10GHz (material dependent)
Impedance Tolerance±5% (TDR tested, 50Ω/100Ω)Back Drilling Depth Control±0.05 mm precision
HDI TechnologyLaser drilled blind/buried vias, 0.1 mm holeVia-in-PadResin plugging & copper plated over
ENIG ThicknessAu 2-4u" / Ni 120-200u"Copper Foil TypeHVLP / RTF / VLP (for low loss)
CertificationsUL, RoHS, REACH, ISO9001, IATF16949


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