Double Layer PCB for Reverse Engineering & Copying Green Solder Mask for OEM Electronics Based on FR-4

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Double Layer PCB for Reverse Engineering & Copying Green Solder Mask for OEM Electronics Based on FR-4


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Type communication pcba Copper Thickness 1 oz Supplier Type OEM ODM MOQ 1 PCS SMT Production Line 8 SMT Production Capacity 8.5 million solder joints per day Thickness 0.5mm or more Trace/ Spacing 12/12μm or more Hole Size min 0.1mm Layers single-sided or double-sided Finished product Size within 200*200mm


Typecommunication pcbaCopper Thickness1 oz
Supplier TypeOEM ODMMOQ1 PCS
SMT Production Line8SMT Production Capacity8.5 million solder joints per day
Thickness0.5mm or moreTrace/ Spacing12/12μm or more
Hole Sizemin 0.1mmLayerssingle-sided or double-sided
Finished product Sizewithin 200*200mm


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