Double Sided Heavy Copper Substrate PCB Embedded Cu Blocks for Advanced Cooling in High Power Motor Drives
Price varies depending on material, logo, quantity and customization requirements.
Introduction
| Material | ShengYi (IT-180A) / Isola / Bergquist / Rogers | Functional Application | High Power Motor Drive |
| Type | Heavy Copper PCB / Embedded Copper Block Substrate | Base Material | High TG FR4 (TG170/180) / Aluminum / Copper Base |
| Board Thickness | 2.0mm / 3.0mm / 3.2mm / 4.0mm | Copper Thickness | 3oz / 4oz / 6oz / 8oz / 10oz (Extreme Heavy Copper |
| Min. Hole Size | 0.3mm (Mechanical) / 0.5mm (Large Current Via) | Min. Line Width | 0.2mm (8mil) |
| Min. Line Spacing | 0.2mm (8mil) | Surface Finishing | HASL Lead-free / ENIG / OSP (High Temp) |
| Board Size | 2-20 Layers (High Power Multilayer) | Thermal Conductivity | 1.0/1.5/2.0/3.0 W/m K (dielectric layer) |
| Tg | >150°C (standard), >170°C (high reliability) | Td | >340°C (for lead-free process), >350°C (high performance) |
| CTE(Z-axis) | <70 ppm/°C (standard),<50 ppm/°C (high reliability) | Peel Strength | >1.2 N/mm (standard),>1.4 N/mm (high reliability) |
| Breakdown Voltage | >2.0 kV AC (standard low voltage),>3.0 kV AC (high voltage) | Dk | 4.2 +0.2 @1GHz (FR4 type),3.5~4.0 @1GHz (low Dk material) |
| Df | <0.02 @1GHz (standard), <0.01 @1GHz (low loss) | PTH Copper Thickness | Average ≥25 um, Min ≥20 um (standard) |
| Aspect Ratio | ≤8:1 (easy, high reliability) ≤10:1 (standard limit) |
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