Electrode Sensor PCB Aluminium Nitride Ceramic Thin Film Circuit Board DPC Gold Plating Substrate

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Electrode Sensor PCB Aluminium Nitride Ceramic Thin Film Circuit Board DPC Gold Plating Substrate


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Material Aluminum Nitrid Application Industrial Ceramic Type Ceramic Plates Processing Service Bending, Welding, Cutting, Punching, Decoiling, Moulding Density: 3.261 g/cm3 Size: Machined according to drawings Processing Service: Cutting, Punching, Moulding Thermal conductivity: ≥180(20 ℃,W/m.k) Feature: Superior Heat Dissipation Linear expansion coefficient: 4.4(RT-400℃,10-6) Dielectric strength: ≥15KV/mm Dissipation factor: 3 x 10-41 MHz Surface roughness: 0.3~0.5Ra(μm)


MaterialAluminum NitridApplicationIndustrial Ceramic
TypeCeramic PlatesProcessing ServiceBending, Welding, Cutting, Punching, Decoiling, Moulding
Density:3.261 g/cm3Size:Machined according to drawings
Processing Service:Cutting, Punching, MouldingThermal conductivity:≥180(20 ℃,W/m.k)
Feature:Superior Heat DissipationLinear expansion coefficient:4.4(RT-400℃,10-6)
Dielectric strength:≥15KV/mmDissipation factor:3 x 10-41 MHz
Surface roughness:0.3~0.5Ra(μm)


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