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Electronic Al2O3 Ceramic Alumina PCB Substrate
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Material Alumina Ceramic Application Industrial Ceramic Type Ceramic Plates Shape Plate Processing Service Moulding, Active metal bonding Material 96%Alumina/ZTA/ALN Shape plate Max Use Temperature 300°C Thermal Conductivity 170 Dielectric loss 0.0003 Density 3.3-3.7
Introduction
| Material | Alumina Ceramic | Application | Industrial Ceramic |
| Type | Ceramic Plates | Shape | Plate |
| Processing Service | Moulding, Active metal bonding | Material | 96%Alumina/ZTA/ALN |
| Shape | plate | Max Use Temperature | 300°C |
| Thermal Conductivity | 170 | Dielectric loss | 0.0003 |
| Density | 3.3-3.7 |
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