Gold Finger PCBA Assembly Service for Graphics Card Motherboard Impedance Control High Performance Electronic PCBA

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Gold Finger PCBA Assembly Service for Graphics Card Motherboard Impedance Control High Performance Electronic PCBA


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Material FR-4 Functional Application Industrial Wireless Communication/Bluetooth/Wi-Fi Type electronic board Base Material FR-4 Board Thickness 1.2-1.6mm(0.05-0.06in) Copper Thickness 1 oz Min. Hole Size ≥0.15mm(≥0.01in) Min. Line Width ≥0.08mm(≥0in) Min. Line Spacing ≥0.08mm(≥0in) Surface Finishing ENIG Board Size 150mm*100mm(5.91in*3.94in) Layers 4 Layers Certificate ISO 9001/ISO 13485/TATF 16949 Panelization 2-Up Panel Application IoT Sensor/Vehicle/Security Equipment Assembly Process […]


MaterialFR-4Functional ApplicationIndustrial Wireless Communication/Bluetooth/Wi-Fi
Typeelectronic boardBase MaterialFR-4
Board Thickness1.2-1.6mm(0.05-0.06in)Copper Thickness1 oz
Min. Hole Size≥0.15mm(≥0.01in)Min. Line Width≥0.08mm(≥0in)
Min. Line Spacing≥0.08mm(≥0in)Surface FinishingENIG
Board Size150mm*100mm(5.91in*3.94in)Layers4 Layers
CertificateISO 9001/ISO 13485/TATF 16949Panelization2-Up Panel
ApplicationIoT Sensor/Vehicle/Security EquipmentAssembly ProcessFull SMT Precision Assembly (QFN, 0402 Components)
Other ServiceConformal coating/ UV glue/Programming Test/DFM/FAE


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