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High Frequency 6 Layer HDI PCB with Laser Drilled Blind Buried Vias and Low Signal Loss for 5G Telecom and Data Center Backhaul
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Number of Layers 6-layer Solder Mask Green Type Multilayer pcb Board Thickness 1.65mm(0.06in) Board Size custom Base Material Rogers / Taconic / Arlon / PTFE / FR4 High TG Copper Thickness 1- 6mm(0.04-0.24in) Min. Hole Size 0.3mm(0.01in) Min. Line Width 267μm Min. Line Spacing 96μm Surface Finishing ENIG (Immersion Gold), Immersion Silver, HASL Layer Count […]
Introduction
| Number of Layers | 6-layer | Solder Mask | Green |
| Type | Multilayer pcb | Board Thickness | 1.65mm(0.06in) |
| Board Size | custom | Base Material | Rogers / Taconic / Arlon / PTFE / FR4 High TG |
| Copper Thickness | 1- 6mm(0.04-0.24in) | Min. Hole Size | 0.3mm(0.01in) |
| Min. Line Width | 267μm | Min. Line Spacing | 96μm |
| Surface Finishing | ENIG (Immersion Gold), Immersion Silver, HASL | Layer Count | 6 layers |
| Surface Roughness Control | HVLP copper: Ra ≤ 0.5um (for minimal signal loss) | Dk / Df | Dk 3.0-10.2 / Df 0.001-0.020 @10GHz (material dependent) |
| Impedance Tolerance | ±5% (TDR tested, 50Ω/100Ω) | Back Drilling Depth Control | ±0.05 mm precision |
| HDI Technology | Laser drilled blind/buried vias, 0.1 mm hole | Via-in-Pad | Resin plugging & copper plated over |
| ENIG Thickness | Au 2-4u" / Ni 120-200u" | Copper Foil Type | HVLP / RTF / VLP (for low loss) |
| Certifications | UL, RoHS, REACH, ISO9001, IATF16949 |
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