High Frequency 6 Layer HDI PCB with Laser Drilled Blind Buried Vias and Low Signal Loss for 5G Telecom and Data Center Backhaul

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High Frequency 6 Layer HDI PCB with Laser Drilled Blind Buried Vias and Low Signal Loss for 5G Telecom and Data Center Backhaul


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Number of Layers 6-layer Solder Mask Green Type Multilayer pcb Board Thickness 1.65mm(0.06in) Board Size custom Base Material Rogers / Taconic / Arlon / PTFE / FR4 High TG Copper Thickness 1- 6mm(0.04-0.24in) Min. Hole Size 0.3mm(0.01in) Min. Line Width 267μm Min. Line Spacing 96μm Surface Finishing ENIG (Immersion Gold), Immersion Silver, HASL Layer Count […]


Number of Layers6-layerSolder MaskGreen
TypeMultilayer pcbBoard Thickness1.65mm(0.06in)
Board SizecustomBase MaterialRogers / Taconic / Arlon / PTFE / FR4 High TG
Copper Thickness1- 6mm(0.04-0.24in)Min. Hole Size0.3mm(0.01in)
Min. Line Width267μmMin. Line Spacing96μm
Surface FinishingENIG (Immersion Gold), Immersion Silver, HASLLayer Count6 layers
Surface Roughness ControlHVLP copper: Ra ≤ 0.5um (for minimal signal loss)Dk / DfDk 3.0-10.2 / Df 0.001-0.020 @10GHz (material dependent)
Impedance Tolerance±5% (TDR tested, 50Ω/100Ω)Back Drilling Depth Control±0.05 mm precision
HDI TechnologyLaser drilled blind/buried vias, 0.1 mm holeVia-in-PadResin plugging & copper plated over
ENIG ThicknessAu 2-4u" / Ni 120-200u"Copper Foil TypeHVLP / RTF / VLP (for low loss)
CertificationsUL, RoHS, REACH, ISO9001, IATF16949


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