High Frequency Pcb

High Frequency PCB manufacturer offering OEM/ODM design, controlled impedance, tested builds for RF, telecom, automotive, industrial projects. Contact us.

High Frequency 6 Layer HDI PCB with Laser Drilled Blind Buried Vias and Low Signal Loss for 5G Telecom and Data Center Backhaul

$2.88-3.88 /pieces

Price varies depending on material, logo, quantity and customization requirements.

MOQ 5 pieces
Model NO. CC-13762
Service OEM / ODM
Quality You Can Trust
Flexible & Scalable Solutions
Customizable Product Options
Comprehensive Specifications
Your Reliable Business Partner
Category: High Frequency Pcb
Factory direct pricing. We ship globally.

Introduction

Number of Layers6-layerSolder MaskGreen
TypeMultilayer pcbBoard Thickness1.65mm(0.06in)
Board SizecustomBase MaterialRogers / Taconic / Arlon / PTFE / FR4 High TG
Copper Thickness1- 6mm(0.04-0.24in)Min. Hole Size0.3mm(0.01in)
Min. Line Width267μmMin. Line Spacing96μm
Surface FinishingENIG (Immersion Gold), Immersion Silver, HASLLayer Count6 layers
Surface Roughness ControlHVLP copper: Ra ≤ 0.5um (for minimal signal loss)Dk / DfDk 3.0-10.2 / Df 0.001-0.020 @10GHz (material dependent)
Impedance Tolerance±5% (TDR tested, 50Ω/100Ω)Back Drilling Depth Control±0.05 mm precision
HDI TechnologyLaser drilled blind/buried vias, 0.1 mm holeVia-in-PadResin plugging & copper plated over
ENIG ThicknessAu 2-4u" / Ni 120-200u"Copper Foil TypeHVLP / RTF / VLP (for low loss)
CertificationsUL, RoHS, REACH, ISO9001, IATF16949

We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.

Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:

  • Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
  • Strict quality control covering material selection, processing, surface finishing, and final packaging;
  • Variety of products and specifications to meet diverse project requirements and application scenarios;
  • OEM & customization support based on drawings, samples, or specific technical requirements;
  • Flexible packaging solutions to ensure safe handling and transportation of products;
  • Continuous improvement in products and services to better support customers in different markets.

If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.

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High Frequency 6 Layer HDI PCB with Laser Drilled Blind Buried Vias and Low Signal Loss for 5G Telecom and Data Center Backhaul

SKU: CC-13762

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