High Frequency Rogers PCB for Industrial Grade Wireless Communication High Speed 5G Telecommunication PCB Fabrication Assembly

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High Frequency Rogers PCB for Industrial Grade Wireless Communication High Speed 5G Telecommunication PCB Fabrication Assembly


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Material FR-4 Functional Application Wireless Data Communication/IIoT Data Transmission Type electronic board Base Material FR-4 High-Tg Board Thickness 1.6mm(0.06in) Copper Thickness 1 oz Min. Hole Size ≥0.3mm(≥0.01in) Min. Line Width ≥0.1mm(≥0in) Min. Line Spacing ≥0.1mm(≥0in) Surface Finishing ENIG Board Size 150mm*150mm(5.91in*5.91in) Layers 4 Layers Certificate ISO 9001/ISO 13485/TATF 16949 Assembly Process SMT + THT Mixed […]


MaterialFR-4Functional ApplicationWireless Data Communication/IIoT Data Transmission
Typeelectronic boardBase MaterialFR-4 High-Tg
Board Thickness1.6mm(0.06in)Copper Thickness1 oz
Min. Hole Size≥0.3mm(≥0.01in)Min. Line Width≥0.1mm(≥0in)
Min. Line Spacing≥0.1mm(≥0in)Surface FinishingENIG
Board Size150mm*150mm(5.91in*5.91in)Layers4 Layers
CertificateISO 9001/ISO 13485/TATF 16949Assembly ProcessSMT + THT Mixed Assembly
ApplicationIndustrial IoT (IIoT) Gateway/Automation Equipment/Sensor NetworkOther ServiceConformal coating/ UV glue/Programming Test/DFM/FAE


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