High Quality Customizable PCB Assembly for Smartphone Motherboards Fast Turnkey Service

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High Quality Customizable PCB Assembly for Smartphone Motherboards Fast Turnkey Service


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Material FR-4 Functional Application IoT Internet of Things Type Pcb Board Base Material FR-4 Board Thickness 17.5mm(0.69in) Copper Thickness 12OZ Min. Hole Size Mechanical: 8mil/0.2mm Laser: 3mil/0.075mm Min. Line Width Inner layer:3mil; outer layer: 4mil Min. Line Spacing 0.076mm(0in) Surface Finishing SMT Lead time 2-30


MaterialFR-4Functional ApplicationIoT Internet of Things
TypePcb BoardBase MaterialFR-4
Board Thickness17.5mm(0.69in)Copper Thickness12OZ
Min. Hole SizeMechanical: 8mil/0.2mm Laser: 3mil/0.075mmMin. Line WidthInner layer:3mil; outer layer: 4mil
Min. Line Spacing0.076mm(0in)Surface FinishingSMT
Lead time2-30


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