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Immersion Silver Humanoid Robot WiFi 5G Wireless Communication PCB Custom Low Loss Multilayer BLE UWB Sub-6GHz RF Board
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Base Material High Tg FR4 (Tg170/180), Low-Df FR4 (Df ≤ 0.012) Board Thickness 1.0-1.6 mm(0.04-0.06in) Copper Thickness 0.5-1 oz Min. Hole Size 0.15 mm(0.01in) Min. Line Width 3 mil Min. Line Spacing 3 mil Surface Finishing Immersion Silver (vacuum-packed) Certificate ISO9001, UL, RoHS, IATF16949 MOQ 1pcs
Introduction
| Base Material | High Tg FR4 (Tg170/180), Low-Df FR4 (Df ≤ 0.012) | Board Thickness | 1.0-1.6 mm(0.04-0.06in) |
| Copper Thickness | 0.5-1 oz | Min. Hole Size | 0.15 mm(0.01in) |
| Min. Line Width | 3 mil | Min. Line Spacing | 3 mil |
| Surface Finishing | Immersion Silver (vacuum-packed) | Certificate | ISO9001, UL, RoHS, IATF16949 |
| MOQ | 1pcs |
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