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Immersion Silver PCB Custom Im-Ag Surface Finish Multilayer Circuit Board RF High Frequency Lead-Free High Tg Halogen-Free Flat
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Type Immersion Silver PCB Base Material FR-4 / High Tg / Halogen-Free / Rogers Board Thickness 0.2mm-3.2mm(0.01in-0.13in) Copper Thickness 0.5oz-6oz Min. Hole Size 0.15mm(0.01in) Min. Line Width 3mil Min. Line Spacing 3mil Surface Finishing Immersion Silver (Im-Ag) Layers 1-28 Certificate ISO9001, IATF16949, UL, RoHS, REACH Solder Mask Green/Blue/Black/Red/White
Introduction
| Type | Immersion Silver PCB | Base Material | FR-4 / High Tg / Halogen-Free / Rogers |
| Board Thickness | 0.2mm-3.2mm(0.01in-0.13in) | Copper Thickness | 0.5oz-6oz |
| Min. Hole Size | 0.15mm(0.01in) | Min. Line Width | 3mil |
| Min. Line Spacing | 3mil | Surface Finishing | Immersion Silver (Im-Ag) |
| Layers | 1-28 | Certificate | ISO9001, IATF16949, UL, RoHS, REACH |
| Solder Mask | Green/Blue/Black/Red/White |
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