Military Grade Power Bank PCB with Circuit Board Assembly Laser Drilling PCBA for Aerospace Using 1-20 Layers, Immersion Gold

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Military Grade Power Bank PCB with Circuit Board Assembly Laser Drilling PCBA for Aerospace Using 1-20 Layers, Immersion Gold


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Type rigid pcb Base Material FR-4 (Glass Fiber Reinforced Epoxy) Board Thickness 0.8mm-3.2mm(0.03in-0.13in) Board Size 100mm*100mm to 500mm*500mm Copper Thickness 1oz-2oz (35-70μm) Min. Hole Size 0.2mm-0.3mm(0.01in-0.01in) Min. Line Width 0.1mm-0.15mm(0in-0.01in) Min. Line Spacing 0.1mm-0.15mm(0in-0.01in) Surface Finishing Organic Solderability Preservative (OSP) Application Consumer electronics, industrial control


Typerigid pcbBase MaterialFR-4 (Glass Fiber Reinforced Epoxy)
Board Thickness0.8mm-3.2mm(0.03in-0.13in)Board Size100mm*100mm to 500mm*500mm
Copper Thickness1oz-2oz (35-70μm)Min. Hole Size0.2mm-0.3mm(0.01in-0.01in)
Min. Line Width0.1mm-0.15mm(0in-0.01in)Min. Line Spacing0.1mm-0.15mm(0in-0.01in)
Surface FinishingOrganic Solderability Preservative (OSP)ApplicationConsumer electronics, industrial control


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