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OEM Flex Rigid PCB with OSP Immersion Gold Surface Finish FR4 Polyimide Material 1oz 4oz Copper Thickness
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Type FPC Base Material FR-4 Board Thickness 1.6mm(0.06in) Copper Thickness 0.5-1 Oz Min. Hole Size 0.2mm/0.3mm Min. Line Width 0.1mm/4mil Min. Line Spacing 0.1mm4mil) Surface Finishing OSP Conductor Plating oem Product name Printed Circuit Board Surface Finishing Immersion Gold Board Thickness 1.6mm-3.2mm Copper Thickness 1oz~4oz Solder mask red,yellow,black,green,white Material FR4,Ployimaid Application Electronics Device Testing X-ray, […]
Introduction
| Type | FPC | Base Material | FR-4 |
| Board Thickness | 1.6mm(0.06in) | Copper Thickness | 0.5-1 Oz |
| Min. Hole Size | 0.2mm/0.3mm | Min. Line Width | 0.1mm/4mil |
| Min. Line Spacing | 0.1mm4mil) | Surface Finishing | OSP |
| Conductor Plating | oem | Product name | Printed Circuit Board |
| Surface Finishing | Immersion Gold | Board Thickness | 1.6mm-3.2mm |
| Copper Thickness | 1oz~4oz | Solder mask | red,yellow,black,green,white |
| Material | FR4,Ployimaid | Application | Electronics Device |
| Testing | X-ray, 3D Paste Thickness, ICT, AOI | Min. Line Space | 0.1mm/4mil |
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