OEM Flex Rigid PCB with OSP Immersion Gold Surface Finish FR4 Polyimide Material 1oz 4oz Copper Thickness

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OEM Flex Rigid PCB with OSP Immersion Gold Surface Finish FR4 Polyimide Material 1oz 4oz Copper Thickness


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Type FPC Base Material FR-4 Board Thickness 1.6mm(0.06in) Copper Thickness 0.5-1 Oz Min. Hole Size 0.2mm/0.3mm Min. Line Width 0.1mm/4mil Min. Line Spacing 0.1mm4mil) Surface Finishing OSP Conductor Plating oem Product name Printed Circuit Board Surface Finishing Immersion Gold Board Thickness 1.6mm-3.2mm Copper Thickness 1oz~4oz Solder mask red,yellow,black,green,white Material FR4,Ployimaid Application Electronics Device Testing X-ray, […]


TypeFPCBase MaterialFR-4
Board Thickness1.6mm(0.06in)Copper Thickness0.5-1 Oz
Min. Hole Size0.2mm/0.3mmMin. Line Width0.1mm/4mil
Min. Line Spacing0.1mm4mil)Surface FinishingOSP
Conductor PlatingoemProduct namePrinted Circuit Board
Surface FinishingImmersion GoldBoard Thickness1.6mm-3.2mm
Copper Thickness1oz~4ozSolder maskred,yellow,black,green,white
MaterialFR4,PloyimaidApplicationElectronics Device
TestingX-ray, 3D Paste Thickness, ICT, AOIMin. Line Space0.1mm/4mil


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