PCB for Smartphones Printed Circuit Board with High-Density Interconnect

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PCB for Smartphones Printed Circuit Board with High-Density Interconnect


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Type hdi pcb Base Material FR4 TG180 Board Thickness 6mm(0.24in) Copper Thickness 3u Min. Hole Size 0.1mil Min. Line Width 0.25mil Min. Line Spacing 0.25mil Surface Finishing ENIG Board Size 4*2cm(1.57*0.79in)


Typehdi pcbBase MaterialFR4 TG180
Board Thickness6mm(0.24in)Copper Thickness3u
Min. Hole Size0.1milMin. Line Width0.25mil
Min. Line Spacing0.25milSurface FinishingENIG
Board Size4*2cm(1.57*0.79in)


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