PCBA Board 1.6mm FR 4 SMT DIP Assembly Multi Channel IoT and Industrial Control Module

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PCBA Board 1.6mm FR 4 SMT DIP Assembly Multi Channel IoT and Industrial Control Module


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Material Flame Retardant PI Substrate Functional Application IoT device modules, industrial control, Type Double-layer PCB, supports SMT and DIP assembly Base Material FR-4 Board Thickness 1.6mm(0.06in) Copper Thickness 35 Min. Hole Size 0.3mm(0.01in) Min. Line Width 0.1mm(0in) Min. Line Spacing 0.1mm(0in) Surface Finishing Immersion Gold (ENIG) Board Size Custom Shape Flexible PCB, Multi-Unit Layout Product […]


MaterialFlame Retardant PI SubstrateFunctional ApplicationIoT device modules, industrial control,
TypeDouble-layer PCB, supports SMT and DIP assemblyBase MaterialFR-4
Board Thickness1.6mm(0.06in)Copper Thickness35
Min. Hole Size0.3mm(0.01in)Min. Line Width0.1mm(0in)
Min. Line Spacing0.1mm(0in)Surface FinishingImmersion Gold (ENIG)
Board SizeCustom Shape Flexible PCB, Multi-Unit LayoutProduct nameIoT devices, LED/Display modules, miniature electronics modules
ApplicationElectronics DeviceBoard SizeL120mm*80mm/Request
ColorGreen ColorMOQ1 PC
Our ServicePCBA Solution DevelopmentPackageVacuum Packaging+bubble Bag+carton
CertificateISO9001/Iso14001/CE/ROHSPaymentTT\PaypalWestern UnionTrade Assurance


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