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Prototype IoT PCB Assembly Fast Turnkey PCBA
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Base Material FR-4 pcba Board Thickness 1.6MM(0.06in) Copper Thickness 1/2OZ Min. Hole Size 0.10mm(0in) Min. Line Width 0.1mm(0in) Min. Line Spacing 0.1mm(0in) Surface Finishing HAL/OSP/ENIG Soldermask Green/White/Black/Blue/white/Red/ Surface Finish Lead freeHASL. Immersion Gold.Gold Plating.OSP.Immersion Min Line Width 3 mil Min Line space 3 mil Min space between pad to pad 3 mil Min hole diameter […]
Introduction
| Base Material | FR-4 pcba | Board Thickness | 1.6MM(0.06in) |
| Copper Thickness | 1/2OZ | Min. Hole Size | 0.10mm(0in) |
| Min. Line Width | 0.1mm(0in) | Min. Line Spacing | 0.1mm(0in) |
| Surface Finishing | HAL/OSP/ENIG | Soldermask | Green/White/Black/Blue/white/Red/ |
| Surface Finish | Lead freeHASL. Immersion Gold.Gold Plating.OSP.Immersion | Min Line Width | 3 mil |
| Min Line space | 3 mil | Min space between pad to pad | 3 mil |
| Min hole diameter | 0.10mm | Min bonding pad diameter | 10mil |
| Max proportion of drilling hole | 1:12.5 | Max size of finish board | 13 inch*35inch |
| Min linewidth of ldets | 0.21-7.0mm |
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